About the product

  • Au Bump

    • Application:

      COF and COG package for TV, Monitor, Notebook DDIC, Mobile, Tablet, Automotive DIC..

    • Process Capability

    • 8” and 12”

    • Bump height (typical) : 8 to 16um

    • Height uniformity WID : ≤ 2um

    • Bump pitch (min) : Straight 21um, Staggered 13um

    • BOA(bump on active circuit) structure available

  • Wafer Test

    • Full wafer probe test range available

  • Backend

    • Complete backend process capability qualified

  • RnD

    • Ready to try any new structure