About the product

  • WLCSP(WLP)/RDL

    • Process capability:

      8” and 12”
    • Bumping process

    • Ball pitch : 0.3, 0.35, 4.0, 5.0mm

    • Ball Height Ball drop : > 0.15mm

    • PI : > 30um

    • RDL thickness : 3um to 20um

    • RDL line / width (min) : 15mm/15um

  • Wafer Test

    • Full wafer probe test range available

  • Backend

    • Complete backend process capability qualified

  • RnD

    • Ready to try any new structure